SQUARE 3X3 WAFER DIPPER (HD HANDLE)(TWO OPENINGS)(SM3WD3REVB)

This Teflon dipper device is used to aid in the coating process for silicon disks. It has two openings, per original client request, in order to remove the wafer once it has been dipped.

The dimensions for this dipper are 3.25 in X 4.50 in X 0.75 in deep with the handle 5.50 inches in length

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